Age | Commit message (Collapse) | Author |
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Implemented extruder stall detection for G1 H1 E moves
Fixed M119 crash when an axis had no endstop
Duet 3 build now loads IAP into RAM
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Also added noexcept specifiers to PCCB files
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Also pin out9 on Duet3 is also called laser and vfd
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Support loading IAP in RAM instead of flash, to make more flash memory available for the main firmware
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Also fixed typo in M557 error messages, and faster CRC calculation on SAME70
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Don't suppress empty responses to HTTP because DWC2 waits for them
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Fixed data corruption during file uploads. We now use a separate task to read data from the GMAC.
Bug fix for M574 S0
Bug fix for software reset data report wheh no module was spinning
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This reverts commit 847fcb466e678dafa7aa7cd70a10d3cff64b29c5.
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Increased minimum current for open load detection from 300mA to 500mA
Added cache flush/invalidate calls to TMC22xx driver
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Moved definitions of max bed and chamber heaters into Pins files
Fixed build errors in some configurations caused by previous changes
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Bug fix: after pausing during a g2/G3 move, resumimg didn't work properly
Bug fix: M579 scale factors were not properly applied to G2/G3 moves
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Bug fix: bed compensation should take account of XY offset of current tool
Pulsed filament monitors: don't display current position, because it is meaningless; also don't include calibration data in M122 report, as for laser and magnetic filament monitors.
Flush and/or invalidate cache around DMA operations that do not use non-cached memory
Fix minimum radius calculation for Scara kinematics
Removed Duet3_V03 configuration
Replaced NumTotalFans by MaxFans
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Also minor changes to StepTimer
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SoftTimer class renamed StepTimer. We now use instances of StepTimer to schedule step interrupts. This means we only need a single compare match interrupt from the step timer TC. In turn this allows us to chain two 16-bit timers together on the SAM4S and SAME70 so we no longer need to keep the upper 16 bits in software or use the overflow interrupt.
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MassStorateg is now a namespace, in preparation for moving some of its data to non-cached memory
SBC transfer buffers moved to non-cached memory
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Enabled the instruction and data caches. Ethernet pbufs should probably be moved to non-cached memory, but for now they are not.
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When setting up G1 H1 or G1 H3 moves that rely on remote endstops, check that the expansion board knows about the
Fixed build errors that occurred in some configurations
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Remote endstops now working properly
M950 H# C"nil" now deletes a heater and doesn;t require a sensor number
MPU is now enabled
M574 report includes remote endstop pin names
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Changed mapping form extruders to logical drives, to reduce memory usage when MaxAxesPlusExtruders < MaxAxes + MaxExtruders
When CAN expansion is supported, use a bitmap of logical drives moving in the DDA to detemine when all logical drives including remote ones have stopped moving
Allow D to be used as an axis letter
Increased maximum number of axes to 10 on Duet 3
Reduced number of default exruders to 1 for all builds
Corrected a bug in G38 handling
Changed software reset code to allow 5 bits for the module number, because we have more than 16 module numbers
Preparation for implementing M950 S and P on expansion boards
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Corrected capabilities of Duet 3 IOx.out pins
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Improved temperature reading accuracy for thermistors at room temperature
Implemented M308 L and H parameters for local thermistors on Duet 3
M115 P parameter is only implemented on those builds that support multiple board types, and only when running config.g at startup
Minor improvements to endstop handling
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Fixed problems with endstop switches sometimes not flagging axes as homed, especially if the endstop was already triggered at the start of the homing move
When remote endstops flag changes in their state, don't apply the state change to the current move unless it is a move that checks endstops
Wait for moves to complete at the start of executing M574
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Fixed temperature wqarnings on druve 5 of Duet 3 main board
Corrected PCCB expansion connector pin names
Simplified Duet 3 board naming
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Also extend M500 P parameter to take multiple values separated by colon.
Conflicts:
src/RepRap.h
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Removed debugPrint when updating expansion board firmware from local SD card
Don't enforce minimum VIN on Duet 3
Fix reporting of M308 S#
Corrected Duet 3 board type string for ATE
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* Restore DHT support
* Large refactoring
DhtHardwareInterface absorbed into DhtTemperatureSensor
Update task moved into Heat as more general SensorsTask
Removed no longer required MaxSpiTempSensors from Pins
* Fix compile error after upstream merge
* Use explicit type instead of auto when initialized with literal
Always read parent sensor number and refactor basic checks in
AdditionalOutputSensor
Initialize AdditionalOutputSensor on succesful configuration
Introduce sensorsCount and calculate wait time based on that
Add EnsureSensorsTask to class Heat to have the SensorsTask only started
when necessary
* Be a bit more defensive against division-by-zero
* Replace Mutex by TaskCriticalSectionLocker
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